Products
Offline AOI EKT-VT-880
Specification
| PCB Application | Application process | After stencil printing, after/before hot air reflow Can test both sides and multiple PCBs simultaneously |
| PCB dimension | 20×20mm-450×350mm | |
| PCB thickness | 0.3-5.0mm | |
| PCB space | top：≤30mm；bottom:≤45mm | |
| Inspection items Visual system | After stencil printing | Solder paste unavailability, insufficient or excessive solder paste, solder paste misalignment, solder paste bridging, stain , scratch and so on. |
| Before or after reflow soldering | Missing or excessive component, misalignment, uneven, edging defect, opposite mounting , wrong polarity, wrong or bad components. | |
| Before or after DIP wave soldering | Excessive or missing component, empty soldering, solder balls, solder misalignment, edging defect, bridging, IC NG, copper stain etc | |
| Image system | CCD camera, German Basler 500 million px | |
| Lighting system | Three-channel white led light source or RGB light source | |
| Resolution ratio | 18um(FOV dimension：28.8 mm×21.6 mm) | |
| Inspection mode | Color calculation, color extraction, gray-scale operations, image matching, etc | |
| Mechanical system | X/Y driving system | AC servo motor, Precision grinding ball screw |
| PCB fixing mode | Auto fixture | |
| Positioning accuracy | <8 um | |
| Moving speed | 800mm/s(MAX) | |
| Orbital adjustment | Manual | |
| Software system | Computing system | Windows XP, ram 16GB |
| Interface language | Chinese/English optional | |
| Inspection output | PCB ID, PCB description, component description,defect description, defect image | |
| Power | AC220±10%，50/60HZ,1KW | |
| Operation temperature | -10-40℃ | |
| Operation humidity | 20-90%RH non condensing | |
| Machine dimension | 900×1100×1300mm | |
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