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Essemtec soldering machine for SMART-SIZED HIGH SPEED DISPENSER

2 7 5 4The Spider offers state-of-the-art technology that can be easily integrated into any production line. It has a wide range of dispensing applications, including Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam and Fill, Underfill, Cavity Fill, 3D Dispensing via laser height mapping, and more.

Process Maximum dispensing speed Piezo Jet Valve: > 720’000 dots/h
Dynamic Shockwave Valve: 720‘000 Dots/h
Archimedean Screw Valve: 24‘000 Dots/h
Dispensing mode Dot, line, curve, interpolated 3D contour
Accuracy Placement XY dots 40 μm (3σ)
Positioning Z axis 20 μm (3σ)
PCB PCB dimensions 50 x 50 mm bis zu 406 x 305 mm (2 x 2” up to 16 x 12”)
Dimensions Machine footprint 880 x 1090 mm (34.7 x 43”)

Post time: Apr-28-2024