Bad mounting caused by components is divided into two types. One is due to human factors, such as the wrong material; the other is the poor appearance of the element itself. Wrong material mostly occurs when the hasty filling is performed once; the poor appearance of the components is mainly caused by external reasons such as storage or transportation.
For misfitting or poor contact caused by poor appearance of the components, it can be screened in the step of action confirmation, but if the error is detected after mounting, it must be reworked and corrected. In order to avoid unnecessary rework and material waste, it is more necessary to carry out the wrong material inspection and the poor appearance screening of the components before mounting.
LCR measuring ability
This is a function of detecting the resistance and capacitors of the chip in the patch machine. It will verify the type of components in the patch machine before mounting, so it can reliably prevent the feeding errors caused by human errors.
Time of detection:
1. Start and restart of automatic operation
2. When filling
3. Sampling inspection
3 D coplanality detection
This function detects a pin exception in the encapsulation element or connector, or a tin-ball exception in the BGA or CSP. In particular, the Z direction abnormality can be reliably detected by the component camera, thus preventing the elements that can cause poor contact from being put into production.
Scope of examination:
1. The Z-direction deformation of the pin
2. Tin ball collapses
Through the LCR detection function and three-dimensional co-plane detector equipped online, the bad components can be completely prevented from being put into production, so as to avoid the rework and material waste caused by poor quality.
Post time: Oct-27-2022