Panasonic SMT Chip Mounter CM602-L

Short Description:

The most suitable module can be selected to place components from microchips to odd-shaped components, as well as depending on the products and the production volume.

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Product Detail

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A Wide Range of Variations

The most suitable module can be selected to place components from microchips to odd-shaped components, as well as depending on the products and the production volume.

*Heads configuration can be changed after purchase.

Machine configuration

Configuration type			12 nozzles /12 nozzles	12 nozzles /8 nozzles	8 nozzles /8 nozzles	12 nozzles /3 nozzles	8 nozzles /3 nozzles	3 nozzles /3 nozzles
Head combination		A	Type A-2	Type A-1	Type A-0	-	-	-
		B	-	-	-	-	-	Type A-0
		C	-	-	-	Type C-1	Type C-0	-
Direct tray support	One side	D	-	Type D-3	Type D-2	Type D-1	Type D-0	-
	One side	E	-	-	-	-	-	Type E-0
	Both sides	F	-	-	Type F-2	-	Type F-1	Type F-0

Improves actual productivity with lighter high-speed head and new optimization

Actual productivity ( IPC9850 )69 500cph (Type A-2)

Lighter high-speed head and new manufacturing sequence optimization has increased productivity by7% compared to the former optimization model Ver.4.

New high-flexibility 8 nozzles headFurther component handling capability

The generalized Ver.5 (optional) expands existing component range. A wide variety of components, ranging from a 0402 chip to50mm and a large size connector (100× 50mm),have become mountable.The 3D sensor and direct tray feeder can be installed as before providing superior handling capabilities for odd-shaped components.

Improves area productivity with compact feeder carts

200mm decrease in Feeder cart size

·Area productivity has increased by 17%

·Equipment maintenance has improved

*The Compact Feeder Cart has compatibility with Conventional Feeder Cart. Both types of the Feeder Carts can be used at the same time.

Increases placement reliability by the 3D sensor

·Component bring-back check function

·Component thickness measurement function after components are changed

·Nozzle tip check function

Component thickness measurement function after components are changed

High-quality placement for IC component via the 3D sensor

High-speed detection via batch scanning.

Highly versatile unit accurately transfers solder/flux for PoP top packaging/C4 mounting on the bump side

High-speed PoP placement

Maintenance through easy operation

Changeable film thickness

Programmable squeegee gap using dataChangeable on film thickness each component

	Max.dimension
8 nozzles	20mm
3 nozzles	38mm

*High-speed heads (12 nozzles) are not supported.

Supply Units

Feeder cart

Type feeder (8 mm~104 mm)

Stick feeder

Automation Units

Automatic tape splicing unit

Feeder maintenance unit

Specifications

Brand	CM602-L
Model	NM-EJM8A
Substrate size	L 50 mm × W 50 mm L 510 mm × W 460 mm
High speed mounting head	12pcs nozzle
Mounting speed	100 000 CPH(0.036 s/chip )
Mounting accuracy	±40 µm/chip(CPK>/=1)
Component Size	0402chip *5 L 12 mm × W 12 mm × T 6.5 mm
Universal mounting head	LS 8cps nozzle
Mounting speed	75 000 CPH(0.048 s/chip )
Mounting accuracy	±40 µm/chip,±35 µm/QFP>/= 24 mm,±50 μm/QFP<24 cpk=”">/=1)
Component size	0402chips 5 L 32 mm × W 32 mm × T 8.5 mm 8Generalized VER.5 option 0402 chip * 5? L 100 mm × W 50 mm × T 15 mm * 6
Multi-function placement head	3pcs nozzle
Mounting speed	20 000 CPH(0.18 s/QFP )
Mounting accuracy	±35 µm/QFP(CPK>/=1)
Component size	0603 chip L 100 mm × W 90 mm × T 25 mm *7
Substrate replacement time	0.9 s(optimum conditions for substrate lengths below 240 mm)
Power supply	Three-phase AC 200,220,380,400,420,480 V, 4.0 KVA
Air pressure source * 1	0.49 MPA,170 L /min(A.N.R.)
Equipment dimensions	W 2 350 mm × D 2 290 mm 2 × H 1 430 mm 3
Weight	3 400 kg