ESSEMTEC SMART-SIZED HIGH SPEED DISPENSER

Short Description:

The Spider – State of the art technology, easily integrated in any line. Wide range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam and Fill, Underfill, Cavity Fill, 3D Dispensing via laser height mapping and more.

Technical Parameters

Maximum dispensing speed

Piezo Jet Valve: > 720’000 dots/h

Dispensing mode

Dot, line, curve, interpolated 3D contour

Placement XY dots

40 μm (3σ)

Positioning Z axis

20 μm (3σ)

PCB dimensions

50 x 50 mm bis zu 406 x 305 mm (2 x 2” up to 16 x 12”)

Machine footprint